3M offers innovative solutions to the electronics industry and is a leading manufacturer of interconnect solutions for board-to-board, wire-to-board, backplane and input/output (I/O) applications. These include 3M™ Wiremount Insulation Displacement Contact (IDC) Connectors, Mini Delta Ribbon (MDR) I/O System, Mini-Clamp Discrete Wire System, MetPak™ High Speed Hard Metric (HSHM) and the new Ultra Hard Metric (UHM) Backplane Connectors. Using industry leading capabilities in CAD - such as NX™ and SLA modeling - 3M's experienced engineers turn ideas into real world solutions.

3M offers solutions for printed circuit board fabrication, board assembly and test, such as adhesives and tapes, embedded capacitor materials, Textool™ Test and Burn-in Sockets, carrier and cover tapes and trays, flexible circuits, and products for reducing electrostatic discharge. 3M also offers solutions for shielding from EMI/RFI, for thermal management and vibration damping, as well as for packaging and labeling.

5516S

5516S

3M

Description

THERM PAD 320MMX230MM

10,876

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5583S 210 MM X 300 MM X 0.5MM

5583S 210 MM X 300 MM X 0.5MM

3M

Description

THERM PAD 300MMX210MM WHITE

10,916

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70.1MM-25-8810

70.1MM-25-8810

3M

Description

THERM PAD 70.1MM DIA ADH 1=25/PK

10,804

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19.81MM-13.21MM-25-8810

19.81MM-13.21MM-25-8810

3M

Description

THERM PAD 19.81MMX13.21MM 1=25PK

10,866

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3M 5578H-05 4.72

3M 5578H-05 4.72" X 5.46YDS

3M

Description

HEAT SINK 120MM X 5M

10,939

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5570N-10

5570N-10

3M

Description

THERM PAD GRY/WHT

10,885

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19.38MM-25.4MM-25-8810

19.38MM-25.4MM-25-8810

3M

Description

THERM PAD 25.4MMX19.38MM 1=25/PK

10,834

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5590H-TO3

5590H-TO3

3M

Description

THERM PAD 41.91MMX28.96MM GRAY

11,168

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5590H-05-1

5590H-05-1"-CIRCLE-100/PK

3M

Description

THERM PAD 25.4MM DIA GRAY

11,236

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8810-7

8810-7"-108YD

3M

Description

THERM TAPE 98.76MX177.8MM W/ADH

10,800

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