3M offers innovative solutions to the electronics industry and is a leading manufacturer of interconnect solutions for board-to-board, wire-to-board, backplane and input/output (I/O) applications. These include 3M™ Wiremount Insulation Displacement Contact (IDC) Connectors, Mini Delta Ribbon (MDR) I/O System, Mini-Clamp Discrete Wire System, MetPak™ High Speed Hard Metric (HSHM) and the new Ultra Hard Metric (UHM) Backplane Connectors. Using industry leading capabilities in CAD - such as NX™ and SLA modeling - 3M's experienced engineers turn ideas into real world solutions.

3M offers solutions for printed circuit board fabrication, board assembly and test, such as adhesives and tapes, embedded capacitor materials, Textool™ Test and Burn-in Sockets, carrier and cover tapes and trays, flexible circuits, and products for reducing electrostatic discharge. 3M also offers solutions for shielding from EMI/RFI, for thermal management and vibration damping, as well as for packaging and labeling.

8805-7

8805-7"X36YD

3M

Description

THERM PAD 32.92MX177.8MM W/ADH

10,938

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57.5MM-57.5MM-10-8815

57.5MM-57.5MM-10-8815

3M

Description

THERM PAD 57.5MMX57.5MM

11,109

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3M 8805 SQUARE-2

3M 8805 SQUARE-2"-100

3M

Description

THERM PAD 50.8MMX50.8MM W/ADH

10,870

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7.62MM-7.62MM-25-8810

7.62MM-7.62MM-25-8810

3M

Description

THERM PAD 7.62MMX7.62MM 1=25/PK

10,950

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32MM-23.4MM-25-8810

32MM-23.4MM-25-8810

3M

Description

THERM PAD 32MMX23.4MM 1=25/PK

10,850

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3M 8805 SQUARE-1

3M 8805 SQUARE-1"-100

3M

Description

THERM PAD 25.4MMX25.4MM W/ADH

10,855

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5586 210 MM X 300 MM X 1.0 MM

5586 210 MM X 300 MM X 1.0 MM

3M

Description

THERM PAD 300MMX210MM WHITE

10,897

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34.9MM-12.7MM-25-8810

34.9MM-12.7MM-25-8810

3M

Description

THERM PAD 34.9MMX12.7MM 1=25/PK

10,990

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5595S-10

5595S-10

3M

Description

THERM PAD 300MMX210MM GRAY

10,902

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19.05MM-14.47MM-25-8810

19.05MM-14.47MM-25-8810

3M

Description

THERM PAD 19.05MMX14.47MM 1=25PK

10,976

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