UPD70F3237BM1GJ(A2)-V55-UEN-A

UPD70F3237BM1GJ(A2)-V55-UEN-A
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Part Number UPD70F3237BM1GJ(A2)-V55-UEN-A
LIXINC Part # UPD70F3237BM1GJ(A2)-V55-UEN-A
Manufacturer Renesas Electronics America
Category Integrated CircuitsEmbedded - Microcontrollers
Description IC MCU 32BIT 256KB FLSH 144FLQFP
Lifecycle Active
RoHS No RoHS Information
EDA/CAD Models UPD70F3237BM1GJ(A2)-V55-UEN-A PCB Footprint and Symbol
Warehouses USA, Europe, China, Hong Kong SAR
Estimated Delivery Jan 27 - Jan 31 2026(Choose Expedited Shipping)
Warranty Up to 1 year [Limited-Warranty]*
Payment Wire Transfer, UnionPay, PayPal, Credit Card, Visa, MasterCard, AmericanExpress, Discover, WesternUnion, MoneyGram
Shipping DHL, UPS, FedEx, TNT, EMS, & More Express Delivery

UPD70F3237BM1GJ(A2)-V55-UEN-A Specifications

Part Number:UPD70F3237BM1GJ(A2)-V55-UEN-A
Brand:Renesas Electronics America
Lifecycle:Active
RoHS:Lead free / RoHS Compliant
Category:Integrated Circuits
Subcategory:Embedded - Microcontrollers
Manufacturer:Renesas Electronics America
Series:V850ES/Fx2
Package:Tape & Reel (TR)
Part Status:Obsolete
Core Processor:V850ES
Core Size:32-Bit
Speed:20MHz
Connectivity:CANbus, CSI, I²C, UART/USART
Peripherals:LVD, PWM, WDT
Number of I/O:128
Program Memory Size:256KB (256K x 8)
Program Memory Type:FLASH
EEPROM Size:-
RAM Size:12K x 8
Voltage - Supply (Vcc/Vdd):3.5V ~ 5.5V
Data Converters:A/D 24x10b
Oscillator Type:Internal
Operating Temperature:-40°C ~ 125°C (TA)
Mounting Type:Surface Mount
Package / Case:144-LQFP
Supplier Device Package:144-FLQFP (20x20)

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In Stock 10808 - More on Order
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