TC1-200G

TC1-200G
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Part Number TC1-200G
LIXINC Part # TC1-200G
Manufacturer Chip Quik, Inc.
Category Fans, Thermal ManagementThermal - Adhesives, Epoxies, Greases, Pastes
Description HEAT SINK COMPOUND - HIGH DENSIT
Lifecycle Active
RoHS No RoHS Information
EDA/CAD Models TC1-200G PCB Footprint and Symbol
Warehouses USA, Europe, China, Hong Kong SAR
Estimated Delivery May 17 - May 21 2024(Choose Expedited Shipping)
Warranty Up to 1 year [Limited-Warranty]*
Payment Wire Transfer, UnionPay, PayPal, Credit Card, Visa, MasterCard, AmericanExpress, Discover, WesternUnion, MoneyGram
Shipping DHL, UPS, FedEx, TNT, EMS, & More Express Delivery

TC1-200G Specifications

Part Number:TC1-200G
Brand:Chip Quik, Inc.
Lifecycle:Active
RoHS:Lead free / RoHS Compliant
Category:Fans, Thermal Management
Subcategory:Thermal - Adhesives, Epoxies, Greases, Pastes
Manufacturer:Chip Quik, Inc.
Series:-
Package:Bulk
Part Status:Active
Type:Silicone Compound
Size / Dimension:200 gram Jar
Usable Temperature Range:-
Color:White
Thermal Conductivity:0.67W/m-K
Features:-
Shelf Life:60 Months
Storage/Refrigeration Temperature:37°F ~ 77°F (3°C ~ 25°C)

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In Stock 10815 - More on Order
Quote Limit No Limit
Lead-Time To be Confirmed
Minimum 1

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Pricing (USD)

Qty. Unit Price Ext. Price
1$49.95000$49.95

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