DIP632-001BLF

DIP632-001BLF
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Part Number DIP632-001BLF
LIXINC Part # DIP632-001BLF
Manufacturer Storage & Server IO (Amphenol ICC)
Category Connectors, InterconnectsSockets for ICs, Transistors
Description CONN IC DIP SOCKET 32POS GOLD
Lifecycle Active
RoHS No RoHS Information
EDA/CAD Models DIP632-001BLF PCB Footprint and Symbol
Warehouses USA, Europe, China, Hong Kong SAR
Estimated Delivery Jan 26 - Jan 30 2026(Choose Expedited Shipping)
Warranty Up to 1 year [Limited-Warranty]*
Payment Wire Transfer, UnionPay, PayPal, Credit Card, Visa, MasterCard, AmericanExpress, Discover, WesternUnion, MoneyGram
Shipping DHL, UPS, FedEx, TNT, EMS, & More Express Delivery

DIP632-001BLF Specifications

Part Number:DIP632-001BLF
Brand:Storage & Server IO (Amphenol ICC)
Lifecycle:Active
RoHS:Lead free / RoHS Compliant
Category:Connectors, Interconnects
Subcategory:Sockets for ICs, Transistors
Manufacturer:Storage & Server IO (Amphenol ICC)
Series:-
Package:Tube
Part Status:Obsolete
Type:DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid):32 (2 x 16)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:30.0µin (0.76µm)
Contact Material - Mating:Beryllium Copper
Mounting Type:Through Hole
Features:Open Frame
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Tin
Contact Finish Thickness - Post:200.0µin (5.08µm)
Contact Material - Post:Brass
Housing Material:Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature:-

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Quick Inquiry

In Stock 10934 - More on Order
Quote Limit No Limit
Lead-Time To be Confirmed
Minimum 1

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Pricing (USD)

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