TMM-108-01-G-S-SM-P

TMM-108-01-G-S-SM-P
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Part Number TMM-108-01-G-S-SM-P
LIXINC Part # TMM-108-01-G-S-SM-P
Manufacturer Samtec, Inc.
Category Connectors, InterconnectsRectangular Connectors - Headers, Male Pins
Description 2MM TERMINAL STRIP
Lifecycle Active
RoHS No RoHS Information
EDA/CAD Models TMM-108-01-G-S-SM-P PCB Footprint and Symbol
Warehouses USA, Europe, China, Hong Kong SAR
Estimated Delivery Jan 27 - Jan 31 2026(Choose Expedited Shipping)
Warranty Up to 1 year [Limited-Warranty]*
Payment Wire Transfer, UnionPay, PayPal, Credit Card, Visa, MasterCard, AmericanExpress, Discover, WesternUnion, MoneyGram
Shipping DHL, UPS, FedEx, TNT, EMS, & More Express Delivery

TMM-108-01-G-S-SM-P Specifications

Part Number:TMM-108-01-G-S-SM-P
Brand:Samtec, Inc.
Lifecycle:Active
RoHS:Lead free / RoHS Compliant
Category:Connectors, Interconnects
Subcategory:Rectangular Connectors - Headers, Male Pins
Manufacturer:Samtec, Inc.
Series:TMM
Package:Tube
Part Status:Active
Connector Type:Header
Contact Type:Male Pin
Pitch - Mating:0.079" (2.00mm)
Number of Positions:8
Number of Rows:1
Row Spacing - Mating:-
Number of Positions Loaded:All
Style:Board to Board or Cable
Shrouding:Unshrouded
Mounting Type:Surface Mount
Termination:Solder
Fastening Type:Push-Pull
Contact Length - Mating:0.126" (3.20mm)
Contact Length - Post:-
Overall Contact Length:-
Insulation Height:0.059" (1.50mm)
Contact Shape:Square
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:20.0µin (0.51µm)
Contact Finish - Post:Gold
Contact Material:Phosphor Bronze
Insulation Material:Liquid Crystal Polymer (LCP)
Features:Pick and Place
Operating Temperature:-55°C ~ 125°C
Ingress Protection:-
Material Flammability Rating:UL94 V-0
Insulation Color:Black
Current Rating (Amps):3.2A per Contact
Voltage Rating:-

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Quick Inquiry

In Stock 11000 - More on Order
Quote Limit No Limit
Lead-Time To be Confirmed
Minimum 1

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Pricing (USD)

Qty. Unit Price Ext. Price
1$2.63000$2.63

Lixinc will offer the most competitive prices for you, please refer to the quotations.

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