For Reference Only
| Part Number | 24-6574-11 |
| LIXINC Part # | 24-6574-11 |
| Manufacturer | Aries Electronics, Inc. |
| Category | Connectors, Interconnects › Sockets for ICs, Transistors |
| Description | CONN IC DIP SOCKET ZIF 24POS TIN |
| Lifecycle | Active |
| RoHS | No RoHS Information |
| EDA/CAD Models | 24-6574-11 PCB Footprint and Symbol |
| Warehouses | USA, Europe, China, Hong Kong SAR |
| Estimated Delivery | Jan 25 - Jan 29 2026(Choose Expedited Shipping) |
| Warranty | Up to 1 year [Limited-Warranty]* |
| Payment |
|
| Shipping | ![]() |
| Part Number: | 24-6574-11 |
| Brand: | Aries Electronics, Inc. |
| Lifecycle: | Active |
| RoHS: | Lead free / RoHS Compliant |
| Category: | Connectors, Interconnects |
| Subcategory: | Sockets for ICs, Transistors |
| Manufacturer: | Aries Electronics, Inc. |
| Series: | 57 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing |
| Number of Positions or Pins (Grid): | 24 (2 x 12) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Tin |
| Contact Finish Thickness - Mating: | 200.0µin (5.08µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Closed Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Tin |
| Contact Finish Thickness - Post: | 200.0µin (5.08µm) |
| Contact Material - Post: | Beryllium Copper |
| Housing Material: | Polyphenylene Sulfide (PPS), Glass Filled |
| Operating Temperature: | - |
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| In Stock | 10831 - More on Order |
|---|---|
| Quote Limit | No Limit |
| Lead-Time | To be Confirmed |
| Minimum | 1 |
Warm Tips: Please fill out the form below. We will contact you as soon as possible.
| Qty. | Unit Price | Ext. Price |
|---|---|---|
| 1 | $19.40250 | $19.4025 |
| 12 | $19.40250 | $232.83 |
Lixinc will offer the most competitive prices for you, please refer to the quotations.
Please feel free to contact us for details.