For Reference Only
| Part Number | 508-AG10D-ES |
| LIXINC Part # | 508-AG10D-ES |
| Manufacturer | TE Connectivity AMP Connectors |
| Category | Connectors, Interconnects › Sockets for ICs, Transistors |
| Description | CONN IC DIP SOCKET 8POS GOLD |
| Lifecycle | Active |
| RoHS | No RoHS Information |
| EDA/CAD Models | 508-AG10D-ES PCB Footprint and Symbol |
| Warehouses | USA, Europe, China, Hong Kong SAR |
| Estimated Delivery | Jan 26 - Jan 30 2026(Choose Expedited Shipping) |
| Warranty | Up to 1 year [Limited-Warranty]* |
| Payment |
|
| Shipping | ![]() |
| Part Number: | 508-AG10D-ES |
| Brand: | TE Connectivity AMP Connectors |
| Lifecycle: | Active |
| RoHS: | Lead free / RoHS Compliant |
| Category: | Connectors, Interconnects |
| Subcategory: | Sockets for ICs, Transistors |
| Manufacturer: | TE Connectivity AMP Connectors |
| Series: | 500 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | DIP, 0.3" (7.62mm) Row Spacing |
| Number of Positions or Pins (Grid): | 8 (2 x 4) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 25.0µin (0.63µm) |
| Contact Material - Mating: | Copper Alloy |
| Mounting Type: | Through Hole |
| Features: | Closed Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Gold |
| Contact Finish Thickness - Post: | 25.0µin (0.63µm) |
| Contact Material - Post: | Copper Alloy |
| Housing Material: | Polyester |
| Operating Temperature: | -55°C ~ 125°C |
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| In Stock | 10882 - More on Order |
|---|---|
| Quote Limit | No Limit |
| Lead-Time | To be Confirmed |
| Minimum | 1 |
Warm Tips: Please fill out the form below. We will contact you as soon as possible.
| Qty. | Unit Price | Ext. Price |
|---|---|---|
| 1 | $1.37681 | $1.37681 |
| 2400 | $1.37681 | $3304.344 |
Lixinc will offer the most competitive prices for you, please refer to the quotations.
Please feel free to contact us for details.