For Reference Only
| Part Number | 44-547-11 |
| LIXINC Part # | 44-547-11 |
| Manufacturer | Aries Electronics, Inc. |
| Category | Connectors, Interconnects › Sockets for ICs, Transistors |
| Description | CONN SOCKET SOIC ZIF 44POS GOLD |
| Lifecycle | Active |
| RoHS | No RoHS Information |
| EDA/CAD Models | 44-547-11 PCB Footprint and Symbol |
| Warehouses | USA, Europe, China, Hong Kong SAR |
| Estimated Delivery | Jan 25 - Jan 29 2026(Choose Expedited Shipping) |
| Warranty | Up to 1 year [Limited-Warranty]* |
| Payment |
|
| Shipping | ![]() |
| Part Number: | 44-547-11 |
| Brand: | Aries Electronics, Inc. |
| Lifecycle: | Active |
| RoHS: | Lead free / RoHS Compliant |
| Category: | Connectors, Interconnects |
| Subcategory: | Sockets for ICs, Transistors |
| Manufacturer: | Aries Electronics, Inc. |
| Series: | 547 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | SOIC, ZIF (ZIP) |
| Number of Positions or Pins (Grid): | 44 (2 x 22) |
| Pitch - Mating: | - |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 20.0µin (0.51µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Closed Frame |
| Termination: | Solder |
| Pitch - Post: | 0.050" (1.27mm) |
| Contact Finish - Post: | Gold |
| Contact Finish Thickness - Post: | 20.0µin (0.51µm) |
| Contact Material - Post: | Beryllium Copper |
| Housing Material: | Polyphenylene Sulfide (PPS), Glass Filled |
| Operating Temperature: | - |
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| In Stock | 10943 - More on Order |
|---|---|
| Quote Limit | No Limit |
| Lead-Time | To be Confirmed |
| Minimum | 1 |
Warm Tips: Please fill out the form below. We will contact you as soon as possible.
| Qty. | Unit Price | Ext. Price |
|---|---|---|
| 1 | $175.48000 | $175.48 |
| 25 | $164.92910 | $4123.2275 |
Lixinc will offer the most competitive prices for you, please refer to the quotations.
Please feel free to contact us for details.