For Reference Only
| Part Number | CLP-132-02-F-S |
| LIXINC Part # | CLP-132-02-F-S |
| Manufacturer | Samtec, Inc. |
| Category | Connectors, Interconnects › Rectangular Connectors - Headers, Receptacles, Female Sockets |
| Description | CONN RCPT 32POS 0.05 GOLD SMD |
| Lifecycle | Active |
| RoHS | No RoHS Information |
| EDA/CAD Models | CLP-132-02-F-S PCB Footprint and Symbol |
| Warehouses | USA, Europe, China, Hong Kong SAR |
| Estimated Delivery | Jan 25 - Jan 29 2026(Choose Expedited Shipping) |
| Warranty | Up to 1 year [Limited-Warranty]* |
| Payment |
|
| Shipping | ![]() |
| Part Number: | CLP-132-02-F-S |
| Brand: | Samtec, Inc. |
| Lifecycle: | Active |
| RoHS: | Lead free / RoHS Compliant |
| Category: | Connectors, Interconnects |
| Subcategory: | Rectangular Connectors - Headers, Receptacles, Female Sockets |
| Manufacturer: | Samtec, Inc. |
| Series: | CLP |
| Package: | Tube |
| Part Status: | Active |
| Connector Type: | Receptacle |
| Contact Type: | Female Socket |
| Style: | Board to Board |
| Number of Positions: | 32 |
| Number of Positions Loaded: | All |
| Pitch - Mating: | 0.050" (1.27mm) |
| Number of Rows: | 1 |
| Row Spacing - Mating: | - |
| Mounting Type: | Surface Mount |
| Termination: | Solder |
| Fastening Type: | Push-Pull |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 3.00µin (0.076µm) |
| Insulation Color: | Black |
| Insulation Height: | 0.084" (2.14mm) |
| Contact Length - Post: | - |
| Operating Temperature: | -55°C ~ 125°C |
| Material Flammability Rating: | UL94 V-0 |
| Contact Finish - Post: | Tin |
| Mated Stacking Heights: | - |
| Ingress Protection: | - |
| Features: | - |
| Current Rating (Amps): | 3.3A per Contact |
| Voltage Rating: | 240VAC, 330VDC |
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| In Stock | 10942 - More on Order |
|---|---|
| Quote Limit | No Limit |
| Lead-Time | To be Confirmed |
| Minimum | 1 |
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| Qty. | Unit Price | Ext. Price |
|---|---|---|
| 1 | $5.83071 | $5.83071 |
Lixinc will offer the most competitive prices for you, please refer to the quotations.
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