CLP-111-02-F-D-BE

CLP-111-02-F-D-BE
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Part Number CLP-111-02-F-D-BE
LIXINC Part # CLP-111-02-F-D-BE
Manufacturer Samtec, Inc.
Category Connectors, InterconnectsRectangular Connectors - Headers, Receptacles, Female Sockets
Description CONN RCPT 22POS 0.05 GOLD SMD
Lifecycle Active
RoHS No RoHS Information
EDA/CAD Models CLP-111-02-F-D-BE PCB Footprint and Symbol
Warehouses USA, Europe, China, Hong Kong SAR
Estimated Delivery Jan 25 - Jan 29 2026(Choose Expedited Shipping)
Warranty Up to 1 year [Limited-Warranty]*
Payment Wire Transfer, UnionPay, PayPal, Credit Card, Visa, MasterCard, AmericanExpress, Discover, WesternUnion, MoneyGram
Shipping DHL, UPS, FedEx, TNT, EMS, & More Express Delivery

CLP-111-02-F-D-BE Specifications

Part Number:CLP-111-02-F-D-BE
Brand:Samtec, Inc.
Lifecycle:Active
RoHS:Lead free / RoHS Compliant
Category:Connectors, Interconnects
Subcategory:Rectangular Connectors - Headers, Receptacles, Female Sockets
Manufacturer:Samtec, Inc.
Series:CLP
Package:Tube
Part Status:Active
Connector Type:Receptacle, Bottom Entry
Contact Type:Female Socket
Style:Board to Board
Number of Positions:22
Number of Positions Loaded:All
Pitch - Mating:0.050" (1.27mm)
Number of Rows:2
Row Spacing - Mating:0.050" (1.27mm)
Mounting Type:Surface Mount
Termination:Solder
Fastening Type:Push-Pull
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:3.00µin (0.076µm)
Insulation Color:Black
Insulation Height:0.084" (2.14mm)
Contact Length - Post:-
Operating Temperature:-55°C ~ 125°C
Material Flammability Rating:UL94 V-0
Contact Finish - Post:Tin
Mated Stacking Heights:-
Ingress Protection:-
Features:-
Current Rating (Amps):3.3A per Contact
Voltage Rating:240VAC, 330VDC

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Quick Inquiry

In Stock 10963 - More on Order
Quote Limit No Limit
Lead-Time To be Confirmed
Minimum 1

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Pricing (USD)

Qty. Unit Price Ext. Price
1$3.96000$3.96
10$3.34757$33.4757
100$2.58676$258.676
500$2.13027$1065.135
1000$1.97811$1978.11
5000$1.86399$9319.95

Lixinc will offer the most competitive prices for you, please refer to the quotations.

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