DF13-8P-1.25H(51)

DF13-8P-1.25H(51)
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Part Number DF13-8P-1.25H(51)
LIXINC Part # DF13-8P-1.25H(51)
Manufacturer Hirose
Category Connectors, InterconnectsRectangular Connectors - Headers, Male Pins
Description CONN HEADER SMD R/A 8POS 1.25MM
Lifecycle Active
RoHS No RoHS Information
EDA/CAD Models DF13-8P-1.25H(51) PCB Footprint and Symbol
Warehouses USA, Europe, China, Hong Kong SAR
Estimated Delivery Jan 25 - Jan 29 2026(Choose Expedited Shipping)
Warranty Up to 1 year [Limited-Warranty]*
Payment Wire Transfer, UnionPay, PayPal, Credit Card, Visa, MasterCard, AmericanExpress, Discover, WesternUnion, MoneyGram
Shipping DHL, UPS, FedEx, TNT, EMS, & More Express Delivery

DF13-8P-1.25H(51) Specifications

Part Number:DF13-8P-1.25H(51)
Brand:Hirose
Lifecycle:Active
RoHS:Lead free / RoHS Compliant
Category:Connectors, Interconnects
Subcategory:Rectangular Connectors - Headers, Male Pins
Manufacturer:Hirose
Series:DF13
Package:Tape & Reel (TR)
Part Status:Active
Connector Type:Header
Contact Type:Male Pin
Pitch - Mating:0.049" (1.25mm)
Number of Positions:8
Number of Rows:1
Row Spacing - Mating:-
Number of Positions Loaded:All
Style:Board to Cable/Wire
Shrouding:Shrouded - 4 Wall
Mounting Type:Surface Mount, Right Angle
Termination:Solder
Fastening Type:Detent Lock
Contact Length - Mating:-
Contact Length - Post:-
Overall Contact Length:-
Insulation Height:0.142" (3.60mm)
Contact Shape:Square
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:8.00µin (0.203µm)
Contact Finish - Post:-
Contact Material:Brass
Insulation Material:Polyamide (PA), Nylon
Features:Board Guide, Solder Retention
Operating Temperature:-35°C ~ 85°C
Ingress Protection:-
Material Flammability Rating:UL94 V-0
Insulation Color:Beige
Current Rating (Amps):1A
Voltage Rating:150V

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Quick Inquiry

In Stock 10995 - More on Order
Quote Limit No Limit
Lead-Time To be Confirmed
Minimum 1

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Pricing (USD)

Qty. Unit Price Ext. Price
1$0.76800$0.768
1000$0.72000$720

Lixinc will offer the most competitive prices for you, please refer to the quotations.

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