0015911300

0015911300
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Part Number 0015911300
LIXINC Part # 0015911300
Manufacturer Woodhead - Molex
Category Connectors, InterconnectsRectangular Connectors - Headers, Male Pins
Description CONN HEADER SMD 30POS 2.54MM
Lifecycle Active
RoHS No RoHS Information
EDA/CAD Models 0015911300 PCB Footprint and Symbol
Warehouses USA, Europe, China, Hong Kong SAR
Estimated Delivery Jan 26 - Jan 30 2026(Choose Expedited Shipping)
Warranty Up to 1 year [Limited-Warranty]*
Payment Wire Transfer, UnionPay, PayPal, Credit Card, Visa, MasterCard, AmericanExpress, Discover, WesternUnion, MoneyGram
Shipping DHL, UPS, FedEx, TNT, EMS, & More Express Delivery

0015911300 Specifications

Part Number:0015911300
Brand:Woodhead - Molex
Lifecycle:Active
RoHS:Lead free / RoHS Compliant
Category:Connectors, Interconnects
Subcategory:Rectangular Connectors - Headers, Male Pins
Manufacturer:Woodhead - Molex
Series:C-Grid 71308
Package:Tube
Part Status:Active
Connector Type:Header, Breakaway
Contact Type:Male Pin
Pitch - Mating:0.100" (2.54mm)
Number of Positions:30
Number of Rows:2
Row Spacing - Mating:0.100" (2.54mm)
Number of Positions Loaded:All
Style:Board to Board or Cable
Shrouding:Unshrouded
Mounting Type:Surface Mount
Termination:Solder
Fastening Type:Push-Pull
Contact Length - Mating:0.320" (8.13mm)
Contact Length - Post:-
Overall Contact Length:-
Insulation Height:0.090" (2.29mm)
Contact Shape:Square
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:30.0µin (0.76µm)
Contact Finish - Post:Tin
Contact Material:Copper Alloy
Insulation Material:Liquid Crystal Polymer (LCP), Glass Filled
Features:Board Guide
Operating Temperature:-
Ingress Protection:-
Material Flammability Rating:UL94 V-0
Insulation Color:Black
Current Rating (Amps):-
Voltage Rating:-

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Quick Inquiry

In Stock 10863 - More on Order
Quote Limit No Limit
Lead-Time To be Confirmed
Minimum 1

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Pricing (USD)

Qty. Unit Price Ext. Price
1$2.60666$2.60666
3024$2.18565$6609.4056

Lixinc will offer the most competitive prices for you, please refer to the quotations.

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