95157-134TLF

95157-134TLF
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Part Number 95157-134TLF
LIXINC Part # 95157-134TLF
Manufacturer Storage & Server IO (Amphenol ICC)
Category Connectors, InterconnectsRectangular Connectors - Headers, Male Pins
Description CONN HEADER SMD 34POS 2.54MM
Lifecycle Active
RoHS No RoHS Information
EDA/CAD Models 95157-134TLF PCB Footprint and Symbol
Warehouses USA, Europe, China, Hong Kong SAR
Estimated Delivery Jan 25 - Jan 29 2026(Choose Expedited Shipping)
Warranty Up to 1 year [Limited-Warranty]*
Payment Wire Transfer, UnionPay, PayPal, Credit Card, Visa, MasterCard, AmericanExpress, Discover, WesternUnion, MoneyGram
Shipping DHL, UPS, FedEx, TNT, EMS, & More Express Delivery

95157-134TLF Specifications

Part Number:95157-134TLF
Brand:Storage & Server IO (Amphenol ICC)
Lifecycle:Active
RoHS:Lead free / RoHS Compliant
Category:Connectors, Interconnects
Subcategory:Rectangular Connectors - Headers, Male Pins
Manufacturer:Storage & Server IO (Amphenol ICC)
Series:BERGSTIK® II
Package:Tube
Part Status:Active
Connector Type:Header
Contact Type:Male Pin
Pitch - Mating:0.100" (2.54mm)
Number of Positions:34
Number of Rows:2
Row Spacing - Mating:0.100" (2.54mm)
Number of Positions Loaded:All
Style:Board to Board
Shrouding:Unshrouded
Mounting Type:Surface Mount
Termination:Solder
Fastening Type:Push-Pull
Contact Length - Mating:0.230" (5.84mm)
Contact Length - Post:-
Overall Contact Length:-
Insulation Height:0.100" (2.54mm)
Contact Shape:Square
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:30.0µin (0.76µm)
Contact Finish - Post:Tin
Contact Material:Phosphor Bronze
Insulation Material:-
Features:-
Operating Temperature:-
Ingress Protection:-
Material Flammability Rating:UL94 V-0
Insulation Color:Black
Current Rating (Amps):-
Voltage Rating:-

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Quick Inquiry

In Stock 10950 - More on Order
Quote Limit No Limit
Lead-Time To be Confirmed
Minimum 1

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Pricing (USD)

Qty. Unit Price Ext. Price
1$2.35957$2.35957
975$2.35957$2300.58075

Lixinc will offer the most competitive prices for you, please refer to the quotations.

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