Winbond Electronics Corporation is a memory IC company engaged in design, manufacturing and sales service to provide its global customers top quality memory solutions. Winbond’s product lines include Code Storage Flash Memory, Serial and Parallel NAND, Specialty DRAM and Mobile DRAM.

Winbond products are widely used by companies in the IoT vertical markets such as computing, connected multimedia devices, automobile, networking systems and industrial. Winbond offers automotive and Industrial –Plus grade Flash and DRAM products with longevity support. Winbond has approximately 2,200 employees worldwide, that includes a 12-inch FAB at its headquarters in Taichung, Taiwan.

W25Q32FVZPJF

W25Q32FVZPJF

Winbond Electronics Corporation

Description

IC FLASH 32MBIT SPI/QUAD 8WSON

10,809

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W632GU6MB-08

W632GU6MB-08

Winbond Electronics Corporation

Description

IC DRAM 2GBIT PARALLEL 96VFBGA

10,853

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W632GG8MB09I

W632GG8MB09I

Winbond Electronics Corporation

Description

IC DRAM 2GBIT PARALLEL 78VFBGA

10,856

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W25X10BVZPIG

W25X10BVZPIG

Winbond Electronics Corporation

Description

IC FLASH 1MBIT SPI 104MHZ 8WSON

10,958

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W25R128FVEIQ

W25R128FVEIQ

Winbond Electronics Corporation

Description

IC FLASH 128MBIT SPI/QUAD 8WSON

10,802

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W632GG8KB-09

W632GG8KB-09

Winbond Electronics Corporation

Description

IC DRAM 2GBIT PARALLEL 78WBGA

10,855

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W25Q64FVZEJQ TR

W25Q64FVZEJQ TR

Winbond Electronics Corporation

Description

IC FLASH 64MBIT SPI/QUAD 8WSON

10,835

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W25Q64JVSSJQ

W25Q64JVSSJQ

Winbond Electronics Corporation

Description

IC FLASH 64MBIT SPI/QUAD 8SOIC

10,859

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W632GU8KB15I

W632GU8KB15I

Winbond Electronics Corporation

Description

IC DRAM 2GBIT PARALLEL 78WBGA

10,943

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W25Q40BWSNIG

W25Q40BWSNIG

Winbond Electronics Corporation

Description

IC FLASH 4MBIT SPI 80MHZ 8SOIC

10,846

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