Winbond Electronics Corporation is a memory IC company engaged in design, manufacturing and sales service to provide its global customers top quality memory solutions. Winbond’s product lines include Code Storage Flash Memory, Serial and Parallel NAND, Specialty DRAM and Mobile DRAM.

Winbond products are widely used by companies in the IoT vertical markets such as computing, connected multimedia devices, automobile, networking systems and industrial. Winbond offers automotive and Industrial –Plus grade Flash and DRAM products with longevity support. Winbond has approximately 2,200 employees worldwide, that includes a 12-inch FAB at its headquarters in Taichung, Taiwan.

W29N01HZBINF

W29N01HZBINF

Winbond Electronics Corporation

Description

IC FLASH 1GBIT PARALLEL 63VFBGA

11,068

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W25Q128JWPIM

W25Q128JWPIM

Winbond Electronics Corporation

Description

IC FLASH 128MBIT SPI/QUAD 8WSON

10,873

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W25Q128JWPIM TR

W25Q128JWPIM TR

Winbond Electronics Corporation

Description

IC FLASH 128MBIT SPI/QUAD 8WSON

10,991

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W949D2DBJX5I TR

W949D2DBJX5I TR

Winbond Electronics Corporation

Description

IC DRAM 512MBIT PARALLEL 90VFBGA

10,853

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W949D2DBJX5I

W949D2DBJX5I

Winbond Electronics Corporation

Description

IC DRAM 512MBIT PARALLEL 90VFBGA

11,931

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W9812G6KH-6

W9812G6KH-6

Winbond Electronics Corporation

Description

IC DRAM 128MBIT PAR 54TSOP II

12,036

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W631GG8MB15I

W631GG8MB15I

Winbond Electronics Corporation

Description

IC DRAM 1GBIT PARALLEL 78VFBGA

10,890

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W25M512JVFIQ

W25M512JVFIQ

Winbond Electronics Corporation

Description

IC FLASH 512MBIT SPI 16SOIC

10,978

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W9825G6KH-6I

W9825G6KH-6I

Winbond Electronics Corporation

Description

IC DRAM 256MBIT PAR 54TSOP II

10,994

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W632GU6NB-12 TR

W632GU6NB-12 TR

Winbond Electronics Corporation

Description

IC DRAM 2GBIT PARALLEL 96VFBGA

10,848

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