RF360 - A Qualcomm-TDK joint venture offers a comprehensive portfolio of filters and filter technologies, including surface acoustic wave (SAW), temperature-compensated surface acoustic wave (TC-SAW) and bulk acoustic wave (BAW) solutions to support the wide range of frequency bands being deployed in networks across the globe, for applications including wireless, automotive and industrial.
B39000E1072X938

B39000E1072X938

RF360 - A Qualcomm-TDK joint venture

Description

FILTER SAW

14,941

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B39901B4330P810

B39901B4330P810

RF360 - A Qualcomm-TDK joint venture

Description

FILTER SAW CU-FRAME

10,992

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B39921B2672F210

B39921B2672F210

RF360 - A Qualcomm-TDK joint venture

Description

SAW COMMERCIAL

10,946

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B39911B3943H110

B39911B3943H110

RF360 - A Qualcomm-TDK joint venture

Description

FILTER SAW 3.0X3.0

10,987

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B39311B3938H110

B39311B3938H110

RF360 - A Qualcomm-TDK joint venture

Description

FILTER SAW SMD

10,802

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B39711B4334P810

B39711B4334P810

RF360 - A Qualcomm-TDK joint venture

Description

FILTER SAW CU-FRAME

10,836

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B39931B4336P810

B39931B4336P810

RF360 - A Qualcomm-TDK joint venture

Description

FILTER SAW CU-FRAME

10,933

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B39921B4344F210

B39921B4344F210

RF360 - A Qualcomm-TDK joint venture

Description

SAW INDUSTRIAL

10,945

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B39711B4337P810

B39711B4337P810

RF360 - A Qualcomm-TDK joint venture

Description

FILTER SAW CU-FRAME

10,990

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B39871R0808H210

B39871R0808H210

RF360 - A Qualcomm-TDK joint venture

Description

SAW RES SMD

10,861

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