RF360 - A Qualcomm-TDK joint venture offers a comprehensive portfolio of filters and filter technologies, including surface acoustic wave (SAW), temperature-compensated surface acoustic wave (TC-SAW) and bulk acoustic wave (BAW) solutions to support the wide range of frequency bands being deployed in networks across the globe, for applications including wireless, automotive and industrial.
B39871R2709U310

B39871R2709U310

RF360 - A Qualcomm-TDK joint venture

Description

SAW RES 868.3000MHZ SMD

10,903

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B39401R709U310

B39401R709U310

RF360 - A Qualcomm-TDK joint venture

Description

SAW RES 403.5500MHZ 3.7PF SMD

10,974

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B39431R806H210

B39431R806H210

RF360 - A Qualcomm-TDK joint venture

Description

SAW RES 433.4200MHZ 2.4PF SMD

10,999

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B39311R884H210

B39311R884H210

RF360 - A Qualcomm-TDK joint venture

Description

SAW RES 310.0000MHZ SMD

10,822

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B39321R805H210

B39321R805H210

RF360 - A Qualcomm-TDK joint venture

Description

SAW RES 318.0000MHZ SMD

10,940

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B39311R2710U310

B39311R2710U310

RF360 - A Qualcomm-TDK joint venture

Description

SAW RES 311.0630MHZ 1.8PF SMD

10,857

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B39431R850H210

B39431R850H210

RF360 - A Qualcomm-TDK joint venture

Description

SAW RES 433.9400MHZ 2.7PF SMD

10,813

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B39921R2706U310

B39921R2706U310

RF360 - A Qualcomm-TDK joint venture

Description

SAW RES 915.0000MHZ SMD

10,868

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B39401R724U310

B39401R724U310

RF360 - A Qualcomm-TDK joint venture

Description

SAW RES 403.9660MHZ SMD

11,000

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B39301R734U310

B39301R734U310

RF360 - A Qualcomm-TDK joint venture

Description

SAW RES 304.3250MHZ SMD

10,839

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