3M offers innovative solutions to the electronics industry and is a leading manufacturer of interconnect solutions for board-to-board, wire-to-board, backplane and input/output (I/O) applications. These include 3M™ Wiremount Insulation Displacement Contact (IDC) Connectors, Mini Delta Ribbon (MDR) I/O System, Mini-Clamp Discrete Wire System, MetPak™ High Speed Hard Metric (HSHM) and the new Ultra Hard Metric (UHM) Backplane Connectors. Using industry leading capabilities in CAD - such as NX™ and SLA modeling - 3M's experienced engineers turn ideas into real world solutions.

3M offers solutions for printed circuit board fabrication, board assembly and test, such as adhesives and tapes, embedded capacitor materials, Textool™ Test and Burn-in Sockets, carrier and cover tapes and trays, flexible circuits, and products for reducing electrostatic discharge. 3M also offers solutions for shielding from EMI/RFI, for thermal management and vibration damping, as well as for packaging and labeling.

36.83MM-44.45MM-25-8810

36.83MM-44.45MM-25-8810

3M

Description

THERM PAD 44.45MMX36.83MM 1=25PK

10,811

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17.8MM-19.8MM-25-8810

17.8MM-19.8MM-25-8810

3M

Description

THERM PAD 19.8MMX17.8MM 1=25/PK

10,825

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3M 8926-02 2

3M 8926-02 2" X 10M

3M

Description

THERM PAD 10M X 50.8MM W/ADH WHT

10,825

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8810-22

8810-22"-36YRDS

3M

Description

THERM TAPE 32.92MX558.8MM

10,982

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35MMX35MM-8810-SQUARES

35MMX35MM-8810-SQUARES

3M

Description

THERM PAD 35MMX35MM WHITE

10,920

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17.78MM-22.86MM-25-8810

17.78MM-22.86MM-25-8810

3M

Description

THERM PAD 22.86MMX17.78MM 1=25PK

10,880

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5595S-210MMX300MM

5595S-210MMX300MM

3M

Description

THERM PAD 300MMX210MM GRAY

10,802

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5516-10

5516-10

3M

Description

THERM PAD 320MMX230MM 1=1PC

10,925

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8.3MM-25MM-25-8810

8.3MM-25MM-25-8810

3M

Description

THERM PAD 25X8.3MM W/ADH 1=25PK

10,882

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15.24MM-14.47MM-25-8810

15.24MM-14.47MM-25-8810

3M

Description

THERM PAD 15.24MMX14.47MM 1=25PK

10,868

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