3M offers innovative solutions to the electronics industry and is a leading manufacturer of interconnect solutions for board-to-board, wire-to-board, backplane and input/output (I/O) applications. These include 3M™ Wiremount Insulation Displacement Contact (IDC) Connectors, Mini Delta Ribbon (MDR) I/O System, Mini-Clamp Discrete Wire System, MetPak™ High Speed Hard Metric (HSHM) and the new Ultra Hard Metric (UHM) Backplane Connectors. Using industry leading capabilities in CAD - such as NX™ and SLA modeling - 3M's experienced engineers turn ideas into real world solutions.

3M offers solutions for printed circuit board fabrication, board assembly and test, such as adhesives and tapes, embedded capacitor materials, Textool™ Test and Burn-in Sockets, carrier and cover tapes and trays, flexible circuits, and products for reducing electrostatic discharge. 3M also offers solutions for shielding from EMI/RFI, for thermal management and vibration damping, as well as for packaging and labeling.

12MM-5M-0.5MM-5550H

12MM-5M-0.5MM-5550H

3M

Description

THERMALLY COND ACRYLIC 12MMX5M (

10,876

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2-5-8810

2-5-8810

3M

Description

THERM TAPE 4.57MX50.8MM ADH WHT

10,875

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25.4MM-41.91MM-25-8810

25.4MM-41.91MM-25-8810

3M

Description

THERM PAD 41.9MMX25.4MM 1=25/PK

10,927

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30MM-25.4MM-25-8810

30MM-25.4MM-25-8810

3M

Description

THERM PAD 30MMX25.4MM 1=25/PK

10,891

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3M 8820 1

3M 8820 1" X 3YD

3M

Description

3M THERMALLY CONDCUTIVE ADHESIVE

10,958

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22MM-18MM-25-8810

22MM-18MM-25-8810

3M

Description

THERM PAD 22MMX18MM W/ADH 1=25PK

10,884

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5550H-05

5550H-05

3M

Description

THERMAL CONDUCTIVE ACRYLIC INTER

10,953

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4.8MM-6.3MM-25-8810

4.8MM-6.3MM-25-8810

3M

Description

THERM PAD 6.3MMX4.8MM 1=25/PK

10,939

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19.05MM-12.7MM-25-8810

19.05MM-12.7MM-25-8810

3M

Description

THERM PAD 19.05MMX12.7MM 1=25/PK

11,000

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18MM-57.25MM-25-8810

18MM-57.25MM-25-8810

3M

Description

THERM PAD 57.25MMX18MM 1=25/PK

10,846

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